Ultrasonic soldering iron utilizes vibrations at a rate of 30,000 to 40,000 times per second (30kHz or 40kHz/sec), specifically ultrasonic energy, to induce cavitation phenomena by applying it to molten solder. This process effectively removes oxide layers from the surface of materials, allowing soldering to take place without the need for flux. It is a unique joining method economically viable for the electronics industry, especially for materials such as ceramics, glass, silicon, and other non-ferrous metals requiring heterogeneous joints in products like display devices, solar modules, and lighting (LED) systems. Moreover, it serves as an environmentally friendly soldering equipment for low-temperature soldering (200~400°C), preserving the fine structure and properties of metal and special materials without alteration.
Soldering possible for non-ferrous metals such as ceramics, glass, silicon, aluminum, etc.
Formation of electrodes possible for ITO/FTO glass and solar cells (silicon, thin-film type)
As per customer's request, various shapes of soldering iron tips can be provided.
MR-540
MR-5030
Application
Specification
Model
MR-540A
MR-5030
Frequency
40 KHz ± 1 KHz
30 KHz ± 1 KHz
Maximum Output
100 Watt
500 Watt
Temperature Range
150 ~ 500 °C
150 ~ 400°C
Power Supply
AC 220V / 50-60 Hz
AC 220V / 50-60 Hz
Ultrasonic Generator
Size
250(W) x 310(L) x 135(H) mm
435(W) x 560(L) x 140(H) mm
Weight
5 Kg
20 Kg
Feature
Ultrasonic Amplitude Adjustable
Ultrasonic Amplitude Adjustable
Iron Handle Length & Diameter
330mm / Ø28
400mm / Ø45
Solderable Materials
ITO Glass, AL, Mo, Cu etc.,
ITO Glass, AL, Mo, Cu etc.,
Video
Soldering copper wire on glass using an Ultrasonic Soldering Iron
Soldering ITO glass using an Ultrasonic Soldering Iron
Ultrasonically Soldering aluminum plate and glass
Ultrasonically Soldering on Rear side of Solar Cell Wafer
Soldering copper wire on glass using an Ultrasonic Soldering Iron
Soldering Aluminum Plate using an Ultrasonic Soldering Iron
