The ultrasonic sputtering target bonding machine is employed for the indium coating of diverse sputtering targets, such as ITO, Al, Mo, Cr, Si, and backing plates, devoid of the utilization of flux.
MECS TECH’s elevated ultrasonic technological proficiency further extends to the provision of equipment designed for the indium coating of rotatory sputtering targets.
MR-1030C
Application
Specification
Model
MR-1030C
Frequency
30 KHz ± 1 KHz
Maximum Output
1000 Watt
Temperature Range
150 ~ 500 °C
Power Supply
220V / 50-60 Hz
Ultrasonic Generator
Size
435(W) x 600(L) x 140(H) mm
Weight
20 Kg
Feature
Ultrasonic Amplitude Adjustable
Handle Length & Diameter
340mm / Ø458
Solderable Materials
ITO, AL, Mo, Cu etc.,
Video
Ultrasonic Bonding Machine for planar sputtering target
Ultrasonic Bonding Machine for planar sputtering target
Ultrasonic Bonding Machine for rotatory sputtering target
