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Ultrasonic Soldering
Ultrasonic Soldering Machine
Product Overview



Ultrasonic Soldering Machine
No Flux · Eco-Friendly · Significant Cost Reduction
MECSTECH’s ultrasonic soldering system is an environmentally friendly, no-flux soldering solution that fundamentally overcomes the limitations of conventional flux-based soldering using harmful chemicals.
Ultrasonic vibration removes oxide layers on the soldering surface, allowing solder to spread uniformly and enabling stable bonding even on materials that are difficult to solder using conventional methods, such as glass, ceramics, and aluminum.
The system is available in horizontal, vertical, and immersion-type configurations depending on the soldering process, covering a wide range of applications from small-scale precision work to fully automated mass production.
Key Features
01
Eco-friendly soldering without the use of flux or chemical agents
02
Clean working environment with no hazardous gas emissions or wastewater
03
Strong, reliable joints with no corrosion, voids, or defects caused by flux residue
04
Ultrasonic vibration allows solder to penetrate uniformly into micro-gaps
05
Enables replacement of copper wire with aluminum wire (up to 80% cost reduction)
06
Improved productivity by eliminating flux application and cleaning processes
07
Applicable to difficult-to-bond materials such as glass, ceramics, and aluminum
08
Supports soldering of dissimilar materials (Al–Cu, Cu–glass, Al–ceramic, etc.)
09
Digital amplifier control with automatic frequency tuning (20kHz ±1kHz)
10
Adjustable ultrasonic amplitude: 10–100%
11
Soldering condition memory (preheating time, soldering time, ultrasonic intensity), up to 10 programs
12
RS-232C / RS-485 ultrasonic data communication support (optional)
Model Comparison
Model Type
Feature
Typical Applications / Main Uses
Horizontal-Type
- Ultrasonic soldering machine in which the ultrasonic
vibration is generated in the horizontal direction
- The most widely used ultrasonic soldering model
vibration is generated in the horizontal direction
- The most widely used ultrasonic soldering model
Precision soldering of electronic components such as lead
wires, electrodes, and terminals
wires, electrodes, and terminals
Vertical-Type
- Ultrasonic soldering machine in which the ultrasonic
vibration is generated from bottom to top
- It is applied to products that are difficult to solder using
a horizontal-type ultrasonic soldering machine
vibration is generated from bottom to top
- It is applied to products that are difficult to solder using
a horizontal-type ultrasonic soldering machine
Sensors, electrodes, glass-to-metal sealing,
coating and encapsulation processes
coating and encapsulation processes
Immersion-Type
- Ultrasonic soldering machine designed for easy tool
horn replacement
- Suitable for manual soldering of relatively small electronic
components or thin wires
horn replacement
- Suitable for manual soldering of relatively small electronic
components or thin wires
Mass production and automated soldering lines
requiring uniform quality
requiring uniform quality
Specifications
Model No.
MS-2020H
MS-2020V
MS-1030H
Frequency
20 kHz ± 1 kHz
20 kHz ± 1 kHz
30 kHz ± 1 kHz
Max Output
2,000 W
1,000 W
Temperature Range
150~400°C
Line voltage
AC220V (Single phase) / 60 Hz
Ultrasonic Generator
Size
Weight
434(W) × 600(L) × 140(H) mm
20 kg
Ultrasonic Soldering Machine
Size
Weight
264(W) × 531(L) × 220(H) mm
235(W) × 235(L) × 490(H) mm
130(W) × 540(L) × 290(H) mm
30 kg
5 kg
Temperature Controller
Size
Weight
250(W) × 320(L) × 140(H) mm
Built-in Type
5 kg
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