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Ultrasonic Soldering
Ultrasonic Sputtering Target Bonding Machine
Product Overview
Ultrasonic Sputtering Target Bonding Machine
No Flux · Ultra-Precision Indium Bonding · Wide Material Compatibility
MECSTECH’s ultrasonic sputtering target bonding system is optimized for flux-free indium bonding of various sputtering targets and backing plates, including ITO, Al, Mo, Cu, Cr, and Si.
By applying ultrasonic vibration, oxide layers on the bonding surfaces are removed, enabling strong and reliable bonds to be formed even at low temperatures. This ensures uniform bonding quality and high long-term reliability.
Key Features
01
Flux-free indium bonding for clean joint interfaces and environmentally friendly processing
02
Compatible with a wide range of targets and backing plates, including ITO, Al, Mo, Cu, Cr, and Si
03
Suitable for ceramic-to-ceramic, metal-to-metal, and ceramic-to-metal bonding
04
Supports bonding of flat and cylindrical sputtering targets as well as plate materials
05
Automation-ready for indium and tin bonding through integration with automated machinery
06
Available in manual and large-format bonding systems suitable for mass production
07
Stable and consistent bonding quality ensured through uniform amplitude control
08
RS-232C / RS-485 ultrasonic data communication support (optional)
Specifications
Model No.
MR – 1030C
Frequency
30 kHz ± 1 kHz
Max Output
1000 W
Temperature Range
150~500℃
Line voltage
AC220V (Single phase) / 60 Hz
Ultrasonic Generator
Size
Weight
434(W) × 600(L) × 140(H) mm
20 kg
Horn Size
50(W) × 10(T) × 85(H) mm
Horn Material
Titanium
Handle Length
340 mm