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Ultrasonic Soldering
Ultrasonic Soldering Machine
Product Overview
Ultrasonic Soldering Machine
No Flux · Eco-Friendly · Significant Cost Reduction
MECSTECH’s ultrasonic soldering system is an environmentally friendly, no-flux soldering solution that fundamentally overcomes the limitations of conventional flux-based soldering using harmful chemicals.
Ultrasonic vibration removes oxide layers on the soldering surface, allowing solder to spread uniformly and enabling stable bonding even on materials that are difficult to solder using conventional methods, such as glass, ceramics, and aluminum.
The system is available in horizontal, vertical, and immersion-type configurations depending on the soldering process, covering a wide range of applications from small-scale precision work to fully automated mass production.
Key Features
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Eco-friendly soldering without the use of flux or chemical agents
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Clean working environment with no hazardous gas emissions or wastewater
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Strong, reliable joints with no corrosion, voids, or defects caused by flux residue
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Ultrasonic vibration allows solder to penetrate uniformly into micro-gaps
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Enables replacement of copper wire with aluminum wire (up to 80% cost reduction)
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Improved productivity by eliminating flux application and cleaning processes
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Applicable to difficult-to-bond materials such as glass, ceramics, and aluminum
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Supports soldering of dissimilar materials (Al–Cu, Cu–glass, Al–ceramic, etc.)
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Digital amplifier control with automatic frequency tuning (20kHz ±1kHz)
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Adjustable ultrasonic amplitude: 10–100%
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Soldering condition memory (preheating time, soldering time, ultrasonic intensity), up to 10 programs
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