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Ultrasonic Soldering
Ultrasonic Soldering Iron
Product Overview


Ultrasonic Soldering Iron
No Flux · Ideal for R&D and Testing · Precision Control
MECSTECH’s ultrasonic soldering iron applies ultrasonic vibration energy at 30–40 kHz (30,000–40,000 vibrations per second) directly to molten solder, inducing cavitation that removes surface oxides without the use of flux and enables stable, reliable soldering.
It is particularly suitable for joining non-ferrous and dissimilar materials—such as ceramics, glass, silicon, and aluminum—that are difficult to solder using conventional methods, and is widely used in industries including displays, solar modules, and LED lighting.
Key Features
01
Ultrasonic vibration generated directly at the soldering tip, enabling soldering of various non-metallic and metallic materials
02
Flux-free soldering of ceramics, glass, silicon, aluminum, and other non-ferrous materials
03
Wide range of tip geometries available (custom designs available upon request)
04
Suitable for electrode formation on ITO/FTO glass and solar cells
05
Low-temperature process (200–400 °C) minimizes material deformation and property changes
06
Compact, lightweight design ideal for small-batch production, laboratories, and testing applications
Specifications
Model No.
MR-5030
MR-540A
Frequency
30 kHz ± 1 kHz
40 kHz ± 1 kHz
Max Output
500 W
100 W
Temperature Range
150~400℃
Line voltage
AC220V (Single phase) / 60 Hz
Ultrasonic Generator
Size
Weight
434(W) × 600(L) × 140(H) mm
215(W) × 410(L) × 125(H) mm
20 kg
5 kg
Horn(Tip) Material
High Speed Steel
Handle
Length
OD
About 390 mm
About 300 mm
45 mm
28 mm
Available Soldering Material
Solar Cell, ITO Glass, AL, Mo, Cu etc
Solar Cell, ITO Glass, AL, Mo, Cu etc