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Ultrasonic Soldering
Ultrasonic Soldering Iron
Product Overview
Ultrasonic Soldering Iron
No Flux · Ideal for R&D and Testing · Precision Control
MECSTECH’s ultrasonic soldering iron applies ultrasonic vibration energy at 30–40 kHz (30,000–40,000 vibrations per second) directly to molten solder, inducing cavitation that removes surface oxides without the use of flux and enables stable, reliable soldering.
It is particularly suitable for joining non-ferrous and dissimilar materials—such as ceramics, glass, silicon, and aluminum—that are difficult to solder using conventional methods, and is widely used in industries including displays, solar modules, and LED lighting.
Key Features
01
Ultrasonic vibration generated directly at the soldering tip, enabling soldering of various non-metallic and metallic materials
02
Flux-free soldering of ceramics, glass, silicon, aluminum, and other non-ferrous materials
03
Wide range of tip geometries available (custom designs available upon request)
04
Suitable for electrode formation on ITO/FTO glass and solar cells
05
Low-temperature process (200–400 °C) minimizes material deformation and property changes
06